Plasma Desmearing is used in the production of circuit boards. During drilling, the drill bits become heated which results in the melting and smearing of the base material of the board. Plasma desmearing is a process that resolves the smear and prevents the circuit from being defective. Plasma desmearing gas mixtures are a combination of Halocarbon-14 and Oxygen. SCI Analytical provides 2 combinations: 20% Halocarbon-14 in Oxygen and 30% Halocarbon-14 in Oxygen.

* Custom mixtures available upon request